South Korea's Dongbu HiTek is showcasing its latest VGA, 1.3 and 2.0 megapixel CMOS Image Sensor chips and camera phone modules at the International IC China trade show, which opens in Shenzhen this week.
"Our focus on developing competitive, high quality CIS chips and camera modules will continue to intensify over the course of 2008," stated Hae-Soo Jeong, Dongbu HiTek senior executive vice president. "We anticipate signing contracts with large customers based on our exceptionally stable and comprehensive production system." He underscored his company's commitment to add high value across a wide range of CIS applications. "Our CIS product roadmap includes next-generation chips and modules that will serve applications beyond camera phones, such as automobile rearview cameras and surveillance cameras."
Dongbu HiTek formally launched its aggressive program to serve Chinese mobile handset OEMs this past July when it established a Shenzhen sales subsidiary and simultaneously entered into a strategic partnership with China based HNT Co., Ltd., a camera module manufacturer. The HNT partnership is expected to expand Dongbu HiTek's monthly capacity to produce camera modules by approximately 1 million units, while also ensuring a stable supply to Chinese OEMs. This synergistic partnership is also expected to drive further enhancements in quality management and timely delivery as it deploys a comprehensive production system that encompasses design, production, test, packaging and module manufacturing.
Dongbu HiTek's IIC China participation highlights the Korean company's strategic initiatives to capture a strong position in China's rapidly growing mobile phone market. China has fast become the global hub for mobile phone manufacturing, currently accounting for about half of all units shipped worldwide. During 2007, the sales of Chinese manufactured mobile phones exceeded 100 units. By some estimates, this number is expected to reach 125 million units by 2010.
During the IIC China event, Dongbu HiTek executives will be meeting with the executives from China's leading mobile handset developers including Mobile Innovation Chip Technology Ltd. and Ginwave Technologies. In-depth discussions are expected to address key product development and marketing objectives.